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HDI technology for high-performance printed circuit boards

Feb 25 2021


HDI technology for high-performance printed circuit boards

Date: ceturtdiena, 2021, 25 februāris 16:08

The global electronics market has been pushing for years towards increasing miniaturization.

This trend is imposed by the market demand for increasingly portable devices, therefore of low weight, and capable of integrating many functions: the real challenge is to reduce the size of the devices, miniaturizing them, and, at the same time, to increase their performance.

The target can be reached basically by working on the structure of the printed circuit board by increasing the density of the components on the surface and the number of connections between the layers that make it up: this need has therefore led to the birth and diffusion of " HDI - High Density Interconnection" structures.

All circuits with pitches’ density per surface with values greater than 20 pitches/cm² greater than traditional printed circuit boards (PCBs) are defined as high interconnection density PCBs (HDI).  This therefore results in smaller size for design parameters such as tracks less than 100 ?m/4mils wide, laser holes with a diameter less than 150 ?m/6mils and pitches with a diameter less than 400 ?m/16mils.

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Feb 9 2021



Date: otrdiena, 2021, 9 februāris 07:52

In the previous technical article we illustrated some defects generated on PCBs due to the presence of humidity.

In particular, we have highlighted that the moisture absorbed by the base material can generate delamination during the assembly of PCBs.

With this second article, relating to the risks generated on PCBs by the presence of humidity, we deepen the subject and deal, in particular, with the impact of humidity on the Tg of the base materials and the consequences on the quality of PCBs and PCBAs.

The Tg of a  polymeric material (laminates and pre-impregnates are partially made of resin) represents the temperature value at which the glass transition begins which we could define as the temperature at which the resin changes its mechanical characteristics starting to soften: for this reason it is important to choose the base material in relation to the expected conditions of use of each PCB.

To read all the article, click here
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Winmate Unleashes the New Military-Grade Ultra Rugged Tablets

Dec 22 2020

New product

Winmate Unleashes the New Military-Grade Ultra Rugged Tablets

Date: otrdiena, 2020, 22 decembris 16:00

Military-grade tablets ready for challenging tasks and tough environments.
Winmate Inc., the leading manufacturer of rugged tablet computers, has announced the newest ultimate mobility solution for military applications – 8.4-inch, 10.4-inch, and 13.3-inch ultra-rugged tablets with the latest processing and data storage. A powerful computing platform packed in a rugged mobile housing is designed for extreme conditions and meets specific defense department defined specifications.
“The design of our new military tablets evolved from a close collaboration with military and government customers,” said Ken Lu, CEO of Winmate Inc. “Ultra-rugged military-grade tablets provide application-focused features for smooth integration into a military environment.”
Ready for diverse and challenging requirements, whether technical or environmental, Winmate’s Military-Grade Ultra Rugged Tablets are tailored for military and government customers to achieve complete situational awareness and real-time data analysis.
Ultra-Rugged Design Built to Survive
The Military Ultra Rugged Tablets are built to survive in the most demanding conditions and harshest environments. Tailored for military applications and packed in an ultra-rugged housing with up to IP65 rating passed the MIL-STD-810 test and withstand the rigors of outdoor environments - water, dust, weather changes, strong vibration, and drop up to 4 ft. to concrete - that may be necessary for military personal.
Smooth Integration into Military Environment
For smooth integration into the existing military environment, Winmate’s Military Ultra Rugged Tablets have military-qualified MIL-STD-38999 connectors with exceptional versatility for LAN/ USB 2.0, RS-232/ RS-422, and DC power input to enable effortless connection to military equipment.
Battlefield Communications with Real-Time Wireless Connectivity
Real-time data access to the right information is crucial for mission-critical and battlefield operations. With wireless connectivity onboard, the Military Ultra Rugged Tablets offer fast and accurate GPS with an outstanding horizontal position accuracy of 2.5 meters, WLAN 802.11 a/b/g/n/ac, BT, and optional WWAN connectivity to enable robust communications anytime and anywhere.
Sunlight Readable Display with Touchscreen
The sunlight-readable display screen gives a premium outdoor viewing experience for those in the field. Touchscreen and physical user-defined buttons add extra convenience for data input and operations even when wearing gloves.
Meeting the MIL-STD-461F Requirements with EMI/ ITO Mesh Solution
MIL-STD-461F is a requirement for the control of electromagnetic interference characteristics of subsystems and equipment. The EMI solution enables compliance with MIL-STD-461F for applications requiring MIL-STD-461F certification. Optional EMI/ ITO mesh solution is available for all Winmate's Military Ultra Rugged Tablets enabling devices to meet MIL-461F emissions requirements.
For more details and questions on Winmate’s Military-Grade Ultra Rugged Tablets, please contact us at sales@winmate.com.tw 
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	Light and Powerful for Full Workforce Mobility: 7” Rugged Handheld Device

Dec 22 2020

New product

Light and Powerful for Full Workforce Mobility: 7” Rugged Handheld Device

Date: otrdiena, 2020, 22 decembris 04:00

Android Rugged Tablet for Workers On-The-Move

Built for Mobility
Instant data collection is extremely vital for public security personnel and workers on-the-go.
The M700DQ8 comes with advanced data collection features, such as an NFC reader or an optional barcode reader. Plus, the built-in 13MP rear-cam and 8MP front-cam makes recording footage, capturing photos, and video communication a breeze.
Plus, the lightweight, rugged design makes it easy for workers to hand-carry this rugged mobile device across multiple locations for hours-on-end.

With unparalleled processing power from Qualcomm® Snapdragon™ 660 CPU and a user-friendly Android 9.0 interface, this device is incredibly easy for first-time users to master in any environment. Workers in logistics management, transportation, and field services can access the latest BT technology for faster speeds, more range, and greater bandwidth. Plus, the device can also be used as an MDT.

Since mobile workers are constantly on the move, having an easy-to-carry, the multi-purpose device makes the job at hand a lot easier. The  M700DQ8 is an Android tablet PC designed to help the mobile workforce save time and increase productivity. Featuring a PCAP touchscreen and ultra-light build (550g),  Winmate also manages to implement its renowned ‘rugged’ design with IP65 and MIL-STD-810G standards, allowing workers to use this device wherever the job takes them.

M700DQ8 Rugged Mobile Device: Benefits
Suitable for Every Industry with its MIL-STD-810G standards and IP65 housing that makes the rugged handheld device virtually invincible.
Work Smarter where the ergonomic kickstand makes it easy for technicians to hand-carry the device across the workshop or place it on any suitable surface.
Removable Batteries means mobile workers can switch batteries to remain productive on the road.
Better Performance than ever before with top-of-the-line Qualcomm® Snapdragon™ 660 processor.
Work Anywhere. The robust design, combined with PCAP touchscreen, optical bonding technology, and programmable function keys makes the M700DQ8 the most versatile rugged handheld device to date.

A Closer Look: M700DQ8
Why Choose Me?

High-performance Android-based tablet with Qualcomm® Snapdragon™ 660 processor, the latest BT technology, and easy-to-use, programmable function keys. The highly-sensitive touch screen, brighter display, and multi-touch support make it easy for users to key in data, rotate images, and zoom in with two fingers.Key Product Features
  • Qualcomm® Snapdragon™ 660
  • 7" (1280 x 720) TFT LCD Display
  • Removable battery: 5300 mAh, 3.7V
  • IP65 and MIL-STD-810G (4ft drop)
  • Projected Capacitive Multi-Touch Screen
  • Optional 1D/2D Barcode Scanner
  • Hot-Swappable Battery Design
  • USB 3.0 Type-C Connector
  • 13 MP Rear Camera/ 8 MP Front Camera
  • Android™ 9.0
About Winmate
Winmate Inc. is a rugged computing and embedded solutions provider for industries operating in some of the most challenging environments. Founded in 1996 in Taipei, Taiwan, where its headquarters, research, and development facility, and production lines are located, today the company has offices and service centers worldwide. Winmate develops rugged industrial-grade computing solutions that advance the Industrial Internet-of-Things (IoT). Industrial display and panel PC, HMI, embedded systems, IoT gateways, rugged tablets and handheld devices for industries ranging from transportation and logistics to marine and military, railway, oil and gas, smart grid, healthcare, and field services. Winmate also provides professional services in customizing products and project management to create a unique solution for specific customer’s needs.

For more information, visit  www.winmate.com.
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Nov 28 2020

Press release

Date: sestdiena, 2020, 28 novembris 23:00

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PCB, the heart of each electronic device

Nov 6 2020

Press release

PCB, the heart of each electronic device

Date: piektdiena, 2020, 6 novembris 11:00

Each electronic device needs one or more PCBs, regardless of applications field and destination sector, from industrial to domestic sector, from automotive to medical sector, from avionics to railways, to renewal energy, to telecoms and many other sectors.
Each sector has specific regulation requirements and each application field presents different technical necessities.
For this reason it is crucial to know not only regulations and be qualified in each industrial sector, but also to be able to answer practically to technical requirements, typical of each different application.
What makes Cistelaier a “unique” PCBs manufacturer, is to be accredited for the following sectors:
-        Industrial: ISO 9001:2015
-        Aerospace & Defence: UNI EN 9100:2016
-        Automotive: IATF:2016
-        Medical: ISO 13485
-        Railway: ISO/TS 22163
and to handle the following standards
-        IPC-A-600, class 2, 3 or class 3DS(A)
-        IPC 6012 (Rigid), IPC 6013 (Rigid-Flex), IPC 6016 (HDI) and IPC 6018 (Microwave)
-        MIL-P-55110 (Rigid) and MIL-P-50884 (Rigid-Flex)
-        ESA-ECSS - Q – ST – 70 – 10C / 11C / 12C
-        ESA-ECSS - Q – ST – 70 – 60C
that are are the basis of design and manufacturing of each electronic device.
This is the necessary premise to be able to realize PCBs in each sector.
Then, practically, electronic devices performances could be improved starting from the base materials choice.
The more-than-40-years know-how of production, together with its capability to use different materials to satisfy the more different requirements, allows Cistelaier to supply optimized PCBs for each possible application.
We can support our partners to reach the best performances from their electronic devices in each sector, for each application.
Do not hesitate to contact us, our technicians are at your disposal!
Make a call to +39 059 269711 or send and e-mail to sales@cistelaier.com.
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The advantage to be part of the PCB Division of Finmasi Group

Okt 11 2020

Press release

The advantage to be part of the PCB Division of Finmasi Group

Date: svētdiena, 2020, 11 oktobris 10:00

Finmasi Group PCB Division is a unique reality in production and sales of PCBs.
One of the main reasons for that is to have developed integrated production systems for the three companies of the PCB Division: Cistelaier in Italy, Techci-Rhône-Alpes in France and EPN Electroprint in Germany.
The aim of this integration process is to make the production systems of the three companies of the PCB Division more and more capable to interact and to replace each other, so that each one of them could offer its own production capacity completing and integrating the one of the others.
In Techci, this integration process has started in 2011 when Finmasi Group acquired it.
Since then, between the Italian plants of Cistelaier and the French plant of Techci has started an accurate technical evaluation and a deep exchange of experiences and technology knowledge.
Harmonic development logics has been carried out, such as base material’s standardization – the chemistry for production included, which is really important in PCBs manufacturing – and technologies's and machinery’s standardization.
The aim was, and still is, to get the best of each company of the PCB Division and to implement it at the PCB Division level so to make it a standard for the PCB Division itself.
This process has allowed enhancing Cistelaier’s and Techci’s best practices maximising the overall results of the PCB Division.
Today the development of the PCB Division is continuing also with EPN Electroprint, a German PCB manufacturer based in Neustadt (Thuringia region) acquired by Finmasi Group in January 2019.
Only after a few months from the acquisition, EPN already qualified and adopted the same preferential materials of the PCB Division, the same chemistry for production and often also the same machineries.
Finmasi Group’s PCB Division integration continues, sure that this logic represents a concrete asset.
Integration activities very similar to those implemented throughout the companies of the PCB Division, have been developed and continue to be subject to improvement also with our Chinese partners for PCB manufacturing.
Indeed, the PCB Division takes advantage of the cooperation of the best Chinese manufacturers to complete its offer, especially for high volumes batches.
This integration allows to offer to our Customers a support wider than that which each one of the companies of the PCB Division could deliver by its own.
This is important, for example, when a higher production capacity is needed, as a result of an order income higher than the forecasted one or when a production breakdown occurs in one of the plants of the PCB Division.
Risk analysis and management are fundamental activities for leading companies in their own market sector such as those of the Finmasi Group’s PCB Division.
www.cistelaier.com  - www.techci.fr - www.epn.de
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Quality comes first in PCBs!

Sep 29 2020

Press release

Quality comes first in PCBs!

Date: otrdiena, 2020, 29 septembris 22:00

To guarantee the respect of the specs and of the building characteristics of PCBs according to requirements and more and more restrictive quality standards, it is necessary to equip the laboratories of the PCB manufacturing and trading companies with instruments capable to support the statistical process control and the analysis of the PCBs manufactured trough these processes, starting from the constitutive base materials.
To grant the quality of PCBs of increasing complexity and technological content all along their life cycle became a “must” for OEM active in all marketing sectors from Aerospace & Defence to Automotive and nevertheless in Rail, Medical and Industrial Automation sectors.
The process of miniaturization together with the new coming needs of PCB consumers in terms of performances of the finished electronic equipment had the cumulated effect to increase the complexity of PCBs and, as a consequence, forced to adopt the most advanced technologies to ascertain PCB conformity both, according to the international standards and according to specific requirements coming from the final customer.
The international standards, the IPC norms before all, suggest, in particular, to improve the interaction among the PCB designers – represented by the final customer in the most of the cases -, the PCB manufacturers and the PCB assembly service companies in order to reduce the criticalities of the PCBA (Assembled PCB) and, more in general, of the finished product.
The test methods to validate the conformity of PCBs are described by the IPC TM650 and by different and additional norms related to specific sectors like the MIL for the Military sector and the ESA ECSS for applications in the Space sector.
The way to prepare and to “read” cross sections are also described by the IPC.
Microsections are adopted to check the internal characteristics of PCBs (i.e copper plating thickness, quality of copper filling for blind vias, quality of resin filled vias in case of via in pad solutions in particular) and for the evaluation of the most critical points like the corners of PTH holes and vias or of the annular ring in where inner layers are drilled so to be connected to each other.
Another important aspect is the verification of correctness of the stack up, mainly, but not only, for PCBs with nets with controlled impedance. With microsections is possible to evaluate the presence and the thickness of each and every layer, and, even more, to evaluate thickness of base copper of the inner layers and of the successive platings with chemical copper and electrolytic copper.
The controlled impedance are calculated in the PCB design phase on the basis of the selected base material to produce it, and then will be rechecked and simulated in feasibility analysis and engineering phase by the PCB manufacturer on the basis of the definitive material agreed by the designer and the PCB manufacturer. The dielectric constant of the insulating material – pre-preg and core of inner layers - together with the section size of the nets determine the value of controlled impedance of nets.
Is possible to check the value of controlled impedance trough specific test coupons designed on the PCB production panel and therefore manufactured together with the PCB.
The necessity to reduce the PCB size forced the PCB designers to increase the number of internal interconnections between layers and to adopt more complex technological solutions like blind vias, single and sequential, stacked or staggered, blind vias and buried vias.
More complex structures with increased drill’s density make the internal structure of PCBs more sensible to thermal stresses related to the soldering process where two options, or a combination of them, are possible: wave soldering process for TH components or SMD soldering process for SMD components.
For this reason, the thermal stress tests are important to simulate the behaviours of PCBs and their robustness during the soldering process of the electronic components on them.
Thermal stresses are executed in order to check and validate the quality of copper plating of PTH holes according to two possible options: 3 thermal stresses at a 288°C (IPC TM 650 2.6) or 6 stress a 260°C (IPC TM650 2.6.27).
In addition to the destructive analysis, so those that force to destroy and waste the PCBs, that are often necessary to investigate the internal characteristics of the PCBs coming from the special processes involved in the PCB manufacturing process, not destructive analysis are performed like the X-Ray Fluorescence Spectroscopy (XRF) to determine the thickness of the PCB finishes (HASL, ENIG, ENEPIG, tin-lead Hot Oil reflow, Immersion Silver, Immersion Tin, iSiG,- Hard Gold).
The analysis of the thickness of the finishes, are not only important to control the process, but they are necessary to prove the conformity of the boards. Not conformity of the thickness of the finishes could, in fact, generate quality problems of electronic components soldering.
Through the contaminometer is also possible to determine the ionic contamination on the PCB surface, on the finishes and on soldermask. This method is known as Resistivity of Solvent Extract ( ROSE) and is performed with the aim to detect excess of halides on PCB surface that could generate soldering defects and weak adhesion of conformal coating.
Moreover, the most recent 3D microscope technologies for inspection allowed to substitute not destructive analysis to destructive ones i.e. to check surface roughness, dimple of filled holes, cavity depth, etching value for RF nets, and for quality verification of laser and mechanical drilled blind vias, back drilled vias included.
This technology allows to significantly reduce the time needed to test and validate the quality of PCBs.
The whole of the aforementioned analysis, together with some additional ones that will be the subject of another short tutorial, grant the conformity of the PCB and its stability during the time.
The results of these analysis are collected in the most common reports adopted to certificate the conformity of products like the FAI Report, the PPAP and the Test Report prepared and filled according to the EN9100, IATF, ISO13485, ISO TS 22163 and ESA ECSS standards and to different/additional requirements coming from customers.
Cistelaier, TECHCI and EPN Electroprint – the three companies of the PCB Division of the Finmasi Group – grant the quality of PCBs through the best available inspection and test technologies.

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Base materials role for high-performance PCBs

Aug 25 2020

Press release

Base materials role for high-performance PCBs

Date: otrdiena, 2020, 25 augusts 10:00

Base materials and laminates, in particular, are increasingly important to high-performance PCBs; low losses as well as low dielectric constant (or consistent dielectric constant) are both critical specs for laminates.
Higher heat resistance is needed for lead-free assembly processes: laminates that need to resist to high temperature must have a higher Decomposition Temperature (called Td).
Additional features important for the new laminates are:
  • uniform glass distribution to get a better quality in laser drilling
  • thinner glass fabrics to get better electrical properties
  • thin dielectrics for distributed capacitance between power and ground 
Moreover, a wide range of laminates that allow to realize embedded components like resistors and/or capacitors are coming from laminates manufacturers.
New laminates “designed” for high-performance PCBs have to be reviewed under thermal-mechanical and electrical aspects.
Here following a list of the typical characteristics to take under consideration during the base material choice.
  • Thermal expansion in x, y and z-axis with special impact on the z-axis for the reliability of the vias (e.g. barrel cracking) and withstand multiple pressing processes. 
Loss tangent (Df) and permittivity (Dk)
  • Parameters for signal integrity and impedance requirements. 
Glass type and resin content
  • Uniform glass distribution helps to get a better quality in laser drilling.
  • Thinner glass fabrics help to get better electrical properties.
  • Thin dielectrics make it possible to get a better distribution of capacitance between power and ground.
Glass transition temperature Tg
  • The temperature at which the material stops acting as a rigid material.
Decomposition temperature Td
  • Higher heat resistance is needed for lead-free assembly processes: laminates that need to resist to high temperature must have a higher Decomposition Temperature (called Td). This is the temperature that a laminate can withstand when it has lost 5% of its weight by thermal gravimetric analysis (TGA). 
Humidity Impact on final product
  • mportant aspects may be the CAF Resistance and moisture absorption. 
Environmental Impact
  • Need of “Low Halogen” laminates for the green electronic
All validated materials used in Cistelaier are listed here following, in cursive the specific ones for high-performance PCBs.
Standard FR4, high Tg Laminates also Halogen Free and specific for High Speed Digital:
  • FR4 standard & Leadfree: Iteq IT140 & IT588; Isola Duraver ML104i - Tg 140 °C; Black FR4
  • Mid Tg epoxy for Lead-free process: Iteq IT158 -Tg 160 °C; Isola IS400 -Tg 150 °C
  • Mid Tg– Halogen Free: Iteq IT40G -Tg 140 °C, IT150G
  • High Tg 180°C epoxy (without filler): Iteq IT180 (also No/Low flow Prepreg); Isola IS420& IS410; ARLON 45N
  • High Tg 180°C epoxy (with filler): Iteq IT180A & IT180i; Isola PCL370HR; Nelco N4000-29; Hitachi 700GR; EMC 827 i
  • High Tg 170°C epoxy – Halogen Free: Iteq IT170GRA1 & IT170G & IT180GN
  • High speed application: Nelco N4000-13(Si) & N4800-20(Si); Isola Fr408HR, IS600(series), Astra and I-Tera; Iteq IT200DK and IT150DA(SE), IT-968 (SE), IT-988G, IT-988G SE; Panasonic Megtron6 and Megtron7
  • Capacitance layer: OAK-Mitsui Faradflex
High-performances materials for avionic/military application:
  • Polyimide Resin System: Arlon 33N, 35N, 84N, 85N, 85HP; Ventec VT901(also No/Low flow); Hitachi MCL-I-671; Isola 95P/96P; NELTEC N 7000VO
  • Epoxy Resin System: Arlon® Kevlar 4NK (Tg 170 °C and 4.7 ppm/°C)
  • Epoxy and Polyimide Thermount® & Para Aramid fiber: ARLON 55NT/85NT
  • Copper/Invar/Copper: tipically 150 μm thick - 17/120/17 μm)
  • Thick copper: up to 500 microns and over, for BusBar application and copper inlay&coin technology
Substrates for flexible circuits:
  • Flexible Laminates-Polyimide film based: DuPont PYRALUX LF; PYRALUX FR
  • Flexible Laminates- Polyimide film based Adhesiveless: PYRALUX AP, PYRALUX AP-Plus & PYRALUX TK
  • Flexible Laminates-Polyimide based Adhesiveless: UBE Upilex; Iteq IF-2LD; Panasonic Felios
  • Emi shielding layer: Tatsuta SF-PC6000 and TATSUTA SF-PC 3300
High Frequency materials Teflon® based and non-Teflon based:
  • Rogers® / Arlon (also Copper/Brass supported): RT/Duroid Family; RO3000 Family; TMM Family; DiClad Family; Isoclad Family; Cuclad Family; AD Family; AR Family; TC Family
  • Rogers® / Arlon®: RO4350 & RO4003 (Back up material for discontinued 25N & 25FR but partially applicable)
  • Rogers®: ULTRALAM® 3850HT - Liquid Crystalline Polymer (LCP)
  • Iteq “new generation” material for RF and Microvawe applications IT-88GMW, IT-8300GA, IT-8338G, IT-8338A, IT-8350G, IT-8350A, IT-8615G with Dk from 3,00 up to 6,15(,05)
  • Taconic®: RF25A2, RF35, RF35A2, RF45, RF60, TSM-DS3, Cer10, FastRise, TACLAM Plus and all teflon family (TLX, TLY, TLE)
  • Nelco: Mercurywave series, Meteorwave (1000 & 4000 Series) and all teflon family
  • Foam: Rohacel HF51.
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Higiēnas Stacija

Aug 3 2020

Press release

Higiēnas Stacija

Date: pirmdiena, 2020, 3 augusts 10:50

Stacija higiēnas-tas obligāto elementu mūsu ikdienas dzīvē.Tika veidoti tā, lai visas darbības varētu veikt, novērš maiņa baktērijas uz tausti sabiedriskās vietās.Stacija higiēnas var būt dozatoru uz dezinfekcijas iekārtā šķidrumu turētāju, vienreizējās lietošanas cimdi vai salvetes turētājs papīra dvieli, papīra padeves tvertnes maskas un grozi atkritumu sanitārajām normām. Apskatīt vairāk https://youtu.be/_QGwy7nfmYQ ; https://youtu.be/TkaFDPgLAQc
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Jūl 25 2020

Press release


Date: sestdiena, 2020, 25 jūlijs 10:00

Cistelaier S.p.A. in Italy together with Techci Rhône-Alpes in France and EPN Electroprint GmbH are the three Printed Circuit Boards manufacturing companies belonging to the Finmasi Group PCB Division.
Cistelaier, established in 1998 merging the two industrial entities, Cistel S.r.l., established in Genoa in 1976 and Laier S.r.l., established in Modena in 1986, manufactures prototypes, small, medium and large series of a very wide range of printed circuit boards: double-sided, multilayer, rigid-flex, rigid and rigid-flex multilayer HDI PCBs and PCBs manufactured with special materials.
Given all its accreditations, produces all kind of PCBs for all market sectors with a very wide range of materials and almost all finishes.
Techci has been established in 1983 in Saint Genix Sur Guiers, France, their capabilities in PCB manufacturing in terms of technology and services are very similar to Cistelaier’ capabilities.
It is mostly focused in Aerospace, Defense and Civil avionic fields.
EPN has been established in 1988 in Neustadt, in Turingia Region in Germany and mainly devoted to production of PCBs for the industrial field.
Our vision is to be leading manufacturer offering Global Services and Local Support to consumers mainly, but not only, on the European market.
Our mission is to continue developing capabilities, services and know-how to offer our customers the widest range of PCBs in terms of technologies and services, from double-sided PCBs to HDI rigid and HDI rigid-flex PCBs of high and very-high technology level, in small, mid and high volumes, even with quick turnaround delivery, manufactured in our own plants in Europe. We complete our offer for high quantities through our fully controlled long standing sourcing-partnerships with highly qualified Asian manufacturers.
Our business model is to supply PCBs to our customers from the first prototype batch, with quick turn around service upon request, to the serial production. W e reserve our capacity and capability to manage QTA service only for our real partners who can share our business model thus contributing to build long-term partnerships that represent the basis to grant our continuity and growth.
What makes the PCB Division unique, is to be certified to produce, not only for the industrial sector through ISO9001:2015 but also for critical sectors such as:
§  Aerospace & Defence: UNI EN 9100:2016 (Cistelaier & Techci)
§  Avionic : NADCAP (Techci)
§  Automotive: IATF:2016 (Cistelaier)
§  Medical: ISO 13485 (Cistelaier)
§  Railway: ISO/TS 22163 (Cistelaier & Techci)
Products are manufactured according to the following standards and specific control plans are agreed with customers if needed:
§  IPC-A-600, class 2, 3 or class 3DS(A)
§  IPC 6012 (Rigid), IPC 6013 (Rigid-Flex), IPC 6016 (HDI) and IPC 6018 (Microwave)
§  MIL-P-55110 (Rigid) and MIL-P-50884 (Rigid-Flex)
§  ESA-ECSS - Q – ST – 70 – 10C / 11C / 12C
§  ESA-ECSS - Q – ST – 70 – 60C
Cistelaier, Techci and EPN are also IPC Members and several employees are Qualified IPC Trainers and IPC Specialists. Thanks to their know-how and accreditations and to their flexible service they have been able to become technological partners of customers performing in almost all market sectors.
Cistelaier and Techci produce and sell all kinds of PCBs: double-sided PCBs, rigid multilayer boards up to 40 layers, rigid-flex boards up to 12 flex layers and HDI multilayer rigid and rigid-flex boards.
Cistelaier and Techci validated their processes to produce with more than 100 different base materials so as to deliver PCBs for all possible applications.
They produce with standard-performance materials and with high-performance materials (i.e. Hi Tg, Alogen Free, Hi-speed, epoxy and polyimidic resin materials, copper/invar/copper, HI frequency materials Teflon and not Teflon based, thick copper materials).
EPN produces PCBs of what we call standard technology from single-sided PCBs to 10 layers PCBs even with quick-turn delivery service.
The PCB Division could deliver PCBs with
-        lines and spaces down to 75 microns width
-        length / width combinations of the panel up to 860 mm x 470 mm
-        thickness of the panel up to 5.5 mm
-        copper thickness up to 500 microns
-        copper coins and bas bars insertion
-        mixed materials build up
-        all finishes: ENIG, ENEPIG, chemical Tin, HAL Lead and Lead free, chemical Silver, OSP, electrolytic Nichel – Gold (Hard & Soft), tin-lead hot oil reflow
-        all colours of solder mask: green, red, blue, black, white, grey and specific RAL on request.
Factories and Organizations of the PCB Division have been designed and implemented in order to be able to provide quick turnaround (QTA) service: this enables customers to get prototypes with short lead times so to improve their time-to-market and business performances.
All information related to products design coming from our customers are systematically verified in order to identify any risk factors through DFM, DFT and FMEA analysis.
Through our own mechanical and chemical LABs we can deliver all possible analysis results requested by PPAP Reports, CoC Reports or FAIR (First Article Inspection Reports) or by customized qualification processes for PCB conformity validation.
Our people, highly skilled in PCB design and manufacturing, are ready to support our partners at any time.

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Zobu gala dzirnavu (Milling Bur) palaišana

Jan 1 2020

New product

Zobu gala dzirnavu (Milling Bur) palaišana

Date: trešdiena, 2020, 1 janvāris 15:00

Pagājušajā gadā mēs esam atklājuši zobu endmill (Milling Bur).
Mūsu Dental EndMill (Milling Bur) ir labs produkts rentablai un labai kvalitātei.

Mēs Korejā tirgojamies vairāk nekā gadu un uz to reaģējam labi.
Tas ir lētāk nekā iekārtas, ko piegādā aprīkojuma uzņēmums, un aprīkojuma garums ir noteikts tā, lai katru mašīnu varētu uzstādīt.

Ja jums ir kādi jautājumi, lūdzu, nekautrējieties sazināties ar mums.
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Kopsavilkums par Eiropas pārtikas sastāvdaļas izstāde

Dec 3 2019

Participate in an event

Kopsavilkums par Eiropas pārtikas sastāvdaļas izstāde

Date: otrdiena, 2019, 3 decembris 00:00

Eiropas pārtikas sastāvdaļas izstāde(Fi Eiro) notika Parc des Parīzē, Francija no gada 3. - 5., 2019. FIE ir augstākais līmenis, pārtikas un veselības sastāvdaļas nozares starptautisko notikumu. Šī izstāde ir lielisks saziņas platformu vairāk nekā 23,600 , ražošanas un iepirkumu jomā un 1,300 izstādes no 127 valstīm visā pasaulē. Kā lielisks ražotājs un pārdevējs fermentu preparāta Ķīnā, SUNSON starptautiskās nodaļas vadīja Mr Du yunping, general manager, apmeklēja nozares notikums grupas vārdā corporation. Tas ir pilnībā pierādīja mūsu konkurences priekšrocība, no R&D un produkcijas pārdošanas un pakalpojumu cepšanas fermenti, kura ir nostiprinājusi pamatus tālākai attīstībai, Eiropas maizes tirgus. Izmantojot uzkrāšanas izstādes pēdējos gados un sākotnējās attīstības darbu, mūsu kompānija ir uzkrājusi lielu skaitu augstas kvalitātes Eiropas klientiem. Šajā izstādē nodrošina mūs ar laba vieta, lai mēs varētu efektīvi saņemt un apmeklēt klientiem, lai parādītu SUNSON spēku. Tajā pašā laikā, mēs varam arī uzņemties iniciatīvu tikties ar potenciālajiem klientiem rūpniecības jomā, kas ir iespējamo sadarbību ar mums, un mēs varētu tikties arī esošajiem klientiem, veicināt labāku saziņu starp abām pusēm, un vēl vairāk paplašināt sadarbību. Pamatojoties uz komunikāciju ar klientiem, jo šo izstādi, mums ir labāka izpratne par jaunu tendenci Eiropas pārtikas nozares tirgu un noteikumi, kas sniedz arī dažu informācijas bāzi par mums lai attīstītu Eiropas tirgū. Uz šādu darbu, ir vairāk svarīgi, es uzskatu, ka, pamatojoties uz SUNSON galvenais konditorejas izstrādājumi ar priekšrocībām, kas saistīta ar nepārtrauktajiem centieniem un izpētes jo vēlāk, mūsu produkti būs gandarījums tirgus daļu un augsta atpazīstamība Eiropas.
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Latvijas Tālrunis tehnoloģiju konferencē RIGA COMM 2019

Okt 10 2019

Participate in an event

Latvijas Tālrunis tehnoloģiju konferencē RIGA COMM 2019

Date: ceturtdiena, 2019, 10 oktobris 06:00

Location: Latvia

No 10. līdz 11. oktobrim ikgadējā biznesa tehnoloģiju izstādē un konferencēs “RIGA COMM 2019” piedalīsies Latvijā lielākais digitālā mārketinga pakalpojumu sniedzējs maziem un vidējiem uzņēmumiem “Latvijas Tālrunis”.
Pasākuma ietvaros uzņēmuma pārstāvji sniegs izglītojošu lekciju par tēmu “Inteliģentā mājaslapa”, kā arī izstādes apmeklētāji aicināti uz darbnīcu (workshop) par Google My Business (GMB) piedāvātajām iespējām.
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